All electronics engineers want the same things out of their systems: faster speeds, smaller footprints, and enhanced power. This drive places increasingly stringent demands on power supplies, which ...

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

Makers of power semiconductors, including Germany’s Infineon, US-based Texas Instruments and China’s Yangjie Technology, have ...

New-generation DIN-rail power supplies combine high efficiency, compact footprints and robust protection features to support ...

GE Aerospace and Wolfspeed announced a Memorandum of Understanding to collaborate on high-voltage silicon carbide power electronics for aerospace and defense. The agreement focuses on next generation ...

At SNEC 2026 in Shanghai, GCL System Integration (GCL SI) presented a broader view of its next-generation module strategy, ...

The launch marks ABB’s re-entry to the power electronics sector after its divestment of its assets in the industry in 2020. Image: ABB. Swiss electrification company ABB has launched a new power ...

Next month ST will begin volume production of a compact direct Time-of-Flight 3D LiDAR all-in-one module which delivers AI-ready output data for low-compute edge AI systems on small MCUs and ...

Optiemus Electronics partners with Quectel IoT Technologies to locally produce advanced wireless communication modules, strengthening India's electronics ecosystem.

DRAM prices surged over 60% in 2025 as AI demand strains chip supply, raising inflation concerns ahead of key core PCE data.

Molex, a global electronics leader and connectivity innovator, announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors. The introduction of new ...

STMicroelectronics has unveiled the VL53L9, a compact direct Time-of-Flight (dToF) 3D LiDAR module designed to support a wide ...