DATAQUEST

Applied Materials intros new systems to accelerate 3D architectures powering AI chips

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Applied Materials unveils more advanced chipmaking gear for 3D stacking architectures

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

Defect detection automated in diamond, other advanced semiconductors

Materials scientists at Rice University have developed a new workflow methodology for measuring microscopic defects in ...

Layered ZnPS₃ emits single photons, opening new path for quantum chips

Scientists from the Faculty of Physics at the University of Warsaw, in collaboration with teams from the National University ...
Tech Xplore

Engineering the next generation of semiconductor materials, one layer at a time

Silicon is an essential element for creating semiconductors, the building blocks of all modern computing technologies.
Compound Semiconductor

An elegant solution for SiC

Today’s commercial SiC substrates are riddled with these atomic-scale imperfections, with thousands threading through each ...
Nature

Defect Characterization and Control in 2D Materials and Devices

The rapid advancement of 2D materials (2DMs), such as graphene, transition metal dichalcogenides (TMDs), and hexagonal boron nitride (hBN), has revolutionized the field of nanotechnology and ...