Santa Clara, California USA Abstract: Because today’s System-On-Chip (SOC) designs contain millions of transistors, design engineers must treat power dissipation as an important design goal for IP ...
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A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drasticallyHeat dissipation is one of the problems that engineers involved with high-power electronics frequently ... In space, no one can hear your CPU scream, and it won't be cooled by a fan, as there ...
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