As electronic devices become increasingly powerful and compact, they can generate denser heat fluxes, or in other words, produce more heat in a smaller area. These heat fluxes raise the temperature of ...

The FIA’s prototype method for its new Formula 1 cooling device involves cooled water being pumped around driver overalls, with different design approaches permitted in future rules, Motorsport.com ...

The assembly mounting of the two-phase cooling system contains three arrays of copper macrochannels and silicon chips. While overheating is a curse for electronic devices, cooling components often ...