Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
SAN FRANCISCO–While the transistor may be on the minds of many a process R&D engineer these days, back-end-of-line (BEOL) interconnect technology and the materials challenges there– namely integrating ...
Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...
Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received an order from a market-leading equipment ...
The Soitec Group and the SEZ Group have initiated a joint development program (JDP) intended to speed the industrialisation of next-generation strained silicon-on-insulator (sSOI) substrates. Under ...
LSA100L Designed for Front-end-of-line and Middle-of-line Applications for Leading-edge Logic Nodes. SAN JOSE, Calif., Dec. 21, 2010 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier ...
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