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Material scientists create a new compound that has a thermal resistance up to 72% lower than some of the best liquid metals
If there's one topic that's guaranteed to cause a heated discussion amongst PC enthusiasts, it's thermal paste. From how much to use, to what shape you apply, everyone has their own opinion on ...
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New type of paste with enhanced thermal conductivity for modules allows higher power density for same ageing resistance
Infineon Technologies AG has incorporated a TIM material solution from Henkel Electronic Materials to now make available a heat conducting compound optimized specifically for the architecture of power ...