Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced ...

TRUMPF’s HiPIMS-enabled through-glass vias aim to pack more AI-computing power into chips by enabling reliable, high-yield ...

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how ...

A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

California-based AXT makes all its wafer substrates in China, while foreign rivals make similar products in Japan and Germany.

Many of today's electronic devices—from the semiconductors in your cell phone to the photovoltaic cells in your solar panels—are built on thin-film substrates. The thin film is an electrically ...

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As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and ...

In a significant advancement for sustainable industrial practices, a team of international researchers have conducted a systematic review, uncovering 299 alternative substrates across 12 industries ...

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry ...