Polymers are a popular material for everyday objects and have many industrial applications, with their use increasing rapidly. However, for new polymers to be developed and commercialized is often a ...

Dynamic mechanical analysis (DMA) is a technique utilized to determine the viscoelastic characteristics of materials, particularly polymers, by subjecting them to a continuous, oscillating load ...

In reliability engineering, few indicators are as consistently revealing as the particles that infiltrate a lubrication ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

Atomic force microscopy has long relied on the ability to acquire nanoscale chemical information while simultaneously characterizing nanomechanical properties. This article explores a new means of ...

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...